随着新能源汽车和可再生能源的快速发展,碳化硅作为关键半导体材料,以其在电力电子领域的出色表现,备受全球追捧。近日,泰国与印度相继宣布了碳化硅工厂的建设计划,进一步推动这一领域的发展。
01泰国首座碳化硅芯片工厂即将开工据外媒报道,泰国投资委员会(BOI)正式批准支持恒诺微电子和PTT成立合资企业FT1,投资115亿泰铢(约合人民币24.6亿元),在泰国建设首座碳化硅芯片工厂。
该工厂将为电动汽车(EV)、数据中心和储能系统等领域提供关键的电力电子产品,预计两年内投产。
泰国投资委员会秘书长Narit Therdsteerasukdi于9月20日率团访问南奔府,实地考察了FT1的晶圆制造项目。该项目的投资申请于2024年2月获得批准,8月发布了投资促进证明。
FT1目前正处于工厂设计阶段,计划于2023年12月动工建设,预计在2027年第一季度投产。工厂将利用韩国lingxian芯片制造商的技术,生产6英寸和8英寸碳化硅晶圆,助力泰国在半导体行业的崛起。
02印度加快碳化硅产业布局与此同时,印度也在大力推动碳化硅工厂的建设。
9月22日,美国总统拜登与印度总理莫迪在特拉华州举行会晤后宣布,美印两国将共同在印度建立一家芯片制造厂。
该工厂将专注于为下一代电信和绿色能源应用提供先进的感应、通信和电力电子技术,生产红外、氮化镓和碳化硅芯片。据悉,印度半导体任务以及巴拉特半导体公司、3rdiTech公司和美国太空budui的战略技术合作将为其提供支持。
此外,印度境内已有两家企业启动了碳化硅相关项目。
9月4日,Silicon Power Group旗下的RIR Power Electronics Limited宣布,公司将在奥里萨邦投资51亿卢比(约合人民币4.3亿元)建设一座碳化硅半导体制造工厂,预计2025年全面投产,主要专注于碳化硅器件及封装的制造。
紧随其后,9月20日,Zoho集团子公司Silectric Semiconductor Manufacturing宣布,计划在印度奥里萨邦Khurda区投资303.4亿卢比(约合人民币25.6亿元)建设一座碳化硅制造工厂。
该工厂的设计将覆盖整个碳化硅生产链,从晶锭制造到晶圆、MOSFET、模块,再到后续的改装和封装。工厂年产能预计包括7.2万片碳化硅外延晶圆、7.2万个MOSFET和模块,产品将应用于电动汽车、汽车及可再生能源领域。
印度和泰国的碳化硅工厂建设计划不仅加速了两国在半导体行业的发展,也标志着全球在碳化硅技术和应用方面的持续进展。
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