9月25日,晶圆代工厂商晶合集成发布公告称,拟引入农银投资、工融金投等外部投资者共同对全资子公司合肥皖芯集成电路有限公司(以下简称“皖芯集成”)进行增资,各方拟以货币方式合计增95.5亿元。
其中,晶合集成拟出资41.5亿元认缴注册资本 41.45亿元,农银投资等外部投资者拟合计出资54亿元认缴注册资本53.94亿元。本次增资完成后,皖芯集成注册资本将由500万元增加至95.89亿元。
图片来源:晶合集成公告截图
根据公告,本次增资完成前,晶合集成为皖芯集成的全资子公司,增资完成后,晶合集成所持有皖芯集成的股权比例将下降为43.7504%,但仍为皖芯集成第一大股东,同时公司提名的董事占皖芯集成董事会席位过半数,对皖芯集成仍具有控制权。
本次交易前后,皖芯集成股权结构变化情况如下:
图片来源:晶合集成公告截图
资料显示,皖芯集成成立于2022年12月,是晶合集成三期项目的建设主体。据披露,晶合集成三期项目投资总额为210亿元,计划建设12英寸晶圆制造生产线,产能约5万片/月,重点布局55纳米-28纳米显示驱动芯片、55纳米CMOS图像传感器芯片、90纳米电源管理芯片、110纳米微控制器芯片及28纳米逻辑芯片。产品应用覆盖消费电子、车用电子及工业控制等市场领域。
晶合集成是安徽省首家12英寸晶圆代工企业,于2023年在上交所科创板上市。在晶圆代工制程节点方面,晶合集成目前已实现了150nm至55nm制程平台的量产,2024年二季度40nm高压OLED显示驱动芯片已小批量生产,28nm制程平台的研发正在稳步推进中。
目前,晶合集成已实现显示驱动芯片(DDIC)、微控制器(MCU)、CMOS图像传感器(CIS)、电源管理(PMIC)、逻辑应用(Logic)等平台各类产品量产,产品应用涵盖消费电子、智能手机、智能家电、安防、工控、车用电子等领域。
作为中国大陆中排名第三,全球qianshi大晶圆代工厂商之一,晶合集成2024年上半年实现营业收入43.98亿元,同比增长48.09%,归属于上市公司股东净利润为1.87亿元,与上年同期相比增长528.81%,实现扭亏为盈。其中二季度归母净利润1.08亿元,环比一季度增长35.94%。
对于此次增资,晶合集成表示,有利于增强皖芯集成资本实力,加快公司进一步拓展车用芯片特色工艺技术产品线。
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